SOLDER BALL TRANSFER SHEET AND MANUFACTURE THEREOF

Title:

SOLDER BALL TRANSFER SHEET AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JP2000340702

Kind Code:

A

Abstract:

To manufacture and provide a solder ball transfer sheet, of which highly reliable copper-core solder balls batch-transferable to a semiconductor device, are formed and of which solder balls of various structures can be formed at a low cost.

This solder ball transfer sheet is a solder ball transfer sheet 1 with conductor terminals 3, which consist of two or more layers and are formed on a base resin 2, and the manufacturing method of the sheet 1, which consists of a process of forming the resin 2 on a metal plate 6, a process of forming plating masks 8 in the metal plate 6, a process of forming solder layers 5 of the terminals 3 on the metal plate 6 by an electrolytic plating or an electroless plating, a process of removing the masks 8 and a process of forming metal layers 4 of the terminals 3 by etching the plate 6 using the formed layers 5 as etching masks, is carried out in this order for manufacturing the sheet 1.

Inventors:

AOKI HITOSHI
HARA HIDETAKA
NAKAMURA KENSUKE
HOZUMI TAKESHI

Application Number:

JP14686599A

Publication Date:

December 08, 2000

Filing Date:

May 26, 1999

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO

International Classes:

H01L23/12; H01L21/58; H01L21/60; (IPC1-7): H01L23/12; H01L21/58; H01L21/60

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