To solve a problem that, the gold plating has good solder wettability and can be easily solder mounted, but because of good solder wettability the melted solder is transmitted to gold plated surface, a soldering face spreads more than needed, which may result in product deficiency, when gold plating is applied to contact points of connectors of electronic components and the like.

On the part which needs a solder barrier belt, printing is performed beforehand by an ink jet to prevent from generating gold plating. Even if the whole is put into a plating tank, according to the masking effect of ink jet ink, gold plating is not generated onto the portion of ink. A solder barrier belt can be formed by removing the ink later. Since the ink jet printing can perform printing to minute parts, and due to non-contact the printing can be performed also on a stereo configuration, the printing can also be performed onto a complicated configuration or a stereo surface to form a solder barrier belt.