Title:
SOLDER COATING METHOD AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2022161166
Kind Code:
A
Abstract:
To provide a solder coating method for uniformly and flatly coating solder on the surface of a metal material of a metal circuit including a circuit of small size and narrow pitch, and prevent the occurrence of solder bridges between the metal circuits.SOLUTION: A solder coating method for coating a metal material of a circuit board with solder includes a step A of applying a paste containing solder powder and a water-soluble resin to the circuit board, a step B of heating to melt the solder powder, and a step C of removing the paste from the circuit board.SELECTED DRAWING: Figure 1
Inventors:
KURAMOTO TAKEO
TSUKAHARA YOSHITO
TSUKAHARA YOSHITO
Application Number:
JP2021065767A
Publication Date:
October 21, 2022
Filing Date:
April 08, 2021
Export Citation:
Assignee:
MELTEX INC
International Classes:
H05K3/34; B23K35/363; C22C13/00; C22C13/02
Attorney, Agent or Firm:
Yoshimura Katsuhiro