Title:
SOLDER COATING METHOD
Document Type and Number:
Japanese Patent JPH0574539
Kind Code:
A
Abstract:
PURPOSE: To simply provide the solder coating method to a connection portion used as the pre-treatment in the solder connecting technique of electronic parts at a low cost.
CONSTITUTION: A solder paste 2 is solidly coated by printing or spraying on a printing board 1 made of a nonmetal not deposited with solder, an IC package 3 is mounted, and the paste 2 is melted by heating. The solder is deposited on a member terminal, then the printing board 1 and the IC package 3 are separated by cleaning, thus an inexpensive electronic part having the terminal coated finely and smoothly with solder is provided.
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Inventors:
YOSHIE JUNICHIRO
Application Number:
JP23632891A
Publication Date:
March 26, 1993
Filing Date:
September 17, 1991
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01R43/02; H05K3/34; (IPC1-7): H01R43/02
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)