Title:
はんだ組成物および電子基板の製造方法
Document Type and Number:
Japanese Patent JP7361481
Kind Code:
B2
Abstract:
To provide a solder composition which can sufficiently suppress a solder ball and has sufficient solder melting property in soldering at a comparatively low temperature.SOLUTION: A solder composition contains: a flux composition containing (A) a rosin-based resin, (B) an activator and (C) a solvent; and (D) solder powder formed of a solder alloy having a melting point of 170°C or lower, in which the (A) component contains (A1) a rosin-based resin having a softening point of 100°C or lower, and a blending amount of the (A1) component is 50 mass% or more with respect to 100 mass% of the (A) component.SELECTED DRAWING: None
Inventors:
Isao Sugiyama
Nozomi Kanatsu
Nozomi Kanatsu
Application Number:
JP2019056687A
Publication Date:
October 16, 2023
Filing Date:
March 25, 2019
Export Citation:
Assignee:
Tamura Manufacturing Co., Ltd.
International Classes:
B23K35/363; H05K3/34
Domestic Patent References:
| JP2018034190A | ||||
| JP2017035731A | ||||
| JP2003322997A | ||||
| JP2003264367A | ||||
| JP2018140429A | ||||
| JP2013193097A | ||||
| JP2019042805A |
Foreign References:
| CN101966632A | ||||
| CN104416297A | ||||
| CN111015021A |
Attorney, Agent or Firm:
Patent Attorney Corporation Kinoshita Intellectual Property Office
Previous Patent: Rotary tissue cutting control device
Next Patent: Image processing device, imaging device, moving object, and image processing method
Next Patent: Image processing device, imaging device, moving object, and image processing method