Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
Solder constituent
Document Type and Number:
Japanese Patent JP6088204
Kind Code:
B2
More Like This:
JP2662048[Title of Invention] Mg-containing A l Alloy brazing method
JPH0751274INDUSTRIAL APPLICABILITY: Brazing method for aluminum material
JP6460198Flux and solder paste
Inventors:
Kisei Iijima
Saito Mitsu Nozomi
Taiichi Ohno
Kimura Hitomi
Rinzo Tachibana
Application Number:
JP2012238243A
Publication Date:
March 01, 2017
Filing Date:
October 29, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K35/363; B23K1/00; H05K3/34
Domestic Patent References:
JP10189098A
JP2001347395A
JP63303695A
JP7132395A
JP2004291019A
Foreign References:
WO2011076770A2
WO2006095417A1
Attorney, Agent or Firm:
Intellectual Property Office



 
Previous Patent: A display controller, an image data processing system, and a display data processing method of a por...

Next Patent: CUSHION MECHANISM FOR ROCKING DEVICE