PURPOSE: To execute solder heap correction on the basis only of position data concerning defective parts from an inspection equipment, by previously inputting a part of board information read by the inspection equipment, to a correction equipment.

CONSTITUTION: The following are installed; a correction mechanism 2 wherein a soldering iron for heating a defective part and a solder supplying part for supplying solder toward the tip of the soldering iron are formed so as to be freely movable, above a board carried at a specified position, a storage means 1a reading solder heap condition of each soldering part which condition is previously inputted from an inspection equipment 4, and a control means 1b for operating the correction mechanism 2 according to the previously read solder heap condition corresponding with position data when the position data concerning defective parts are inputted.