PURPOSE: To be able to print with high precision at an accurate location on a printed wiring board by a method wherein a solder cream is printed on the printed wiring board through a form plate hole formed in a solder cream printed form plate.

CONSTITUTION: A printed form plate is mounted on a printed wiring board 2 mounted with a chip part 1 thereon, whereby the chip part 1 is inserted into a recess 33 under a die plate 31. Therefore, a lower surface of the die plate 31 can be approached to near a surface of a printed wiring board 2 and a predetermined amount of solder cream 4 can be printed at an accurate location through a form plate hole 32. Thus, after mounting chip parts, the printing of solder cream can be conducted with high precision.