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Title:
はんだ分離装置
Document Type and Number:
Japanese Patent JP4171748
Kind Code:
B2
Abstract:

To provide a solder separation device where solder can be separated from used cream solder.

The solder separation device is equipped with: a melting tank 10 where cream solder containing flux with a solvent as the main component and solder grains composed of a metallic material is heated by a heating means so as to obtain the melt 102 of the cream solder, and the melt 102 is separated into an upper layer 102a composed of molten flux and a lower layer 102b composed of molten solder by a specific gravity difference between the flux and solder; a flux transfer tube 60 connected to the prescribed height position of a tank 11 for transferring the molten flux in the upper layer 102a to the outside of the melting tank 10; and a solder transfer tube 70 connected to the bottom of the tank 11 for transferring the molten solder in the lower layer 102b to the outside of the melting tank 10. The solder can be separated from the cream solder by the separation device provided with such the configuration.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Kuniyuki Kojo
Kinugawa Masuhiro
Application Number:
JP2006045175A
Publication Date:
October 29, 2008
Filing Date:
February 22, 2006
Export Citation:
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Assignee:
Ricoh Microelectronics Co., Ltd.
International Classes:
C22B7/00; F27B17/00; F27D19/00; F27D21/00; H05K3/34
Domestic Patent References:
JP50023324A
JP2005344204A
JP64071572A
JP2003148716A
JP59091065A
JP2000256726A
JP2003049215A
Attorney, Agent or Firm:
Toshi Kuroda