Title:
SOLDER DEFECT DISCOVERY DEVICE
Document Type and Number:
Japanese Patent JP2003053519
Kind Code:
A
Abstract:
To promptly discover the point of a fault by applying vibrations to a printed circuit board or respective parts without exerting undue force thereto in discovering a soldering defect.
A shaft 2 driven by a motor 3 or vibrator is mounted with a vibration transmitter 1 composed of an insulator and this vibration transmitter 1 is connected to the soldered surface of the printed circuit board 13 or the parts to transmit the vibrations thereto, by which the point of the defects is pinpointed and the repair is performed while the appearance of the defect is observed.
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Inventors:
KOBAYASHI TOSHITAKA
Application Number:
JP2001275772A
Publication Date:
February 26, 2003
Filing Date:
August 08, 2001
Export Citation:
Assignee:
KOBAYASHI TOSHITAKA
International Classes:
G01N29/12; B23K1/00; G01M7/02; H05K3/34; B23K101/42; (IPC1-7): B23K1/00; G01M7/02; G01N29/12; H05K3/34
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