To provide a delivery pump suitable for delivery of cream solder (solder cream or solder paste) comprising solid grain dispersed in liquid medium, and an automatic solder charging device capable of automatically charging cream solder in above special form into a small container continuously and quantitatively.

In this piston-shaped delivery pump 1 provided with a cylinder 3 and a piston, the inner diameter of the cylinder 3 is larger than the outer diameter of a piston head 41, and a clearance (80-300 μm) formed at an insertion and engagement side surface part between the cylinder and the piston head is larger than the grain diameter of the solder grain. The vertical width of the piston head is not less than 30% of the outer diameter of the piston head. The automatic solder charging device is provided with the solder delivery pump as a solder injecting means, a container moving means, a solder injection quantity measuring means, a defective sorting means, and a material storage means.