Title:
SOLDER FEED METHOD
Document Type and Number:
Japanese Patent JP3266414
Kind Code:
B2
Abstract:
PURPOSE: To provide a solder feed method in which solder is printed on a board by using a mask and in which the solder can be transferred stably and to provide a solder printing method which prevents a dislocation and a void from being generated and which forms a ball bump whose shape irregularity is small.
CONSTITUTION: A mask 7 is placed on a board 4 in such a way that a pad 5 formed on the board 4 is aligned with an opening part 10 in the mask 7 (b). Then, a solder paste 9 is filled into the opening part 10 by using a squeegee 8 (c). While the mask 7 is being brought into contact with the board as it is, the board is heated by a hot plate 16 at a temperature which is lower than the melting point of solder (d). The mask is taken off from the board, and the solder paste is transferred to the pad 5 (e). In addition, the solder paste is melted, and a ball bump 6 is formed (f).
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Inventors:
Junji Fujino
Kohei Murakami
Teru Adachi
Kohei Murakami
Teru Adachi
Application Number:
JP9532294A
Publication Date:
March 18, 2002
Filing Date:
May 09, 1994
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K1/00; B23K3/06; H05K3/34; H05K3/12; (IPC1-7): H05K3/34
Domestic Patent References:
| JP2201996A |
Attorney, Agent or Firm:
Masuo Oiwa
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