Title:
SOLDER-LESS JOINING USING PULSE DISCHARGE PHENOMENON
Document Type and Number:
Japanese Patent JP2011038153
Kind Code:
A
Abstract:
To provide a joining method for minimizing the heat effect when joining a ceramic product to be easily cracked by the joining (soldering) heat or a member with its performance being degraded by the partial inflation.
Positive electricity and negative electricity are applied to an electrode 11 and a joining intermediate metal 10, respectively, the thermal energy is imparted by the discharge and the conduction, and the vibration and the electric short-circuit are repeated. Thus, a metal (solder or the like) 8 arranged between joining members to be joined is melted to join the members.
Inventors:
MAEDA SHIGEKI
MAEDA MIKIYO
MIZUNO SATOSHI
MAEDA MIKIYO
MIZUNO SATOSHI
Application Number:
JP2009187188A
Publication Date:
February 24, 2011
Filing Date:
August 12, 2009
Export Citation:
Assignee:
DNA METAL KK
MIZUNO HARD TECH KK
MIZUNO HARD TECH KK
International Classes:
C23C26/00; B23K1/19; B23K3/04; B23K28/02; B23K101/36