Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOLDER MATERIAL
Document Type and Number:
Japanese Patent JPH0810981
Kind Code:
A
Abstract:

PURPOSE: To provide a solder material with which a soldered part having excellent corrosion resistance and high reliability is obtainable.

CONSTITUTION: A high-polymer material having water repellency is added to the solder material to impart water repellency to the soldered part so that the water drops 2 adhered to the soldered part are prevented from splashing and adhering atop the soldered part even if the water drops 2 adhere to the soldered part. The high-polymer material, such as tetrafluoroethylene resin (polytetrafluoroethylene) having a water-repellent function is dispersed and incorporated in a range of ≤30wt.% into the solder alloy. As a result, phenomena, such as migration, galvanic corrosion and solder balls, induced by adhesion of the water drops on the soldered surface are prevented and, therefore, the soldered part having the excellent corrosion resistance and the high reliability is obtd.


Inventors:
HISHIYAMA MITSUMASA
YAMAUCHI GORO
ARITA KISHIO
ASAMI KENJI
NISHIHATA MIKIO
Application Number:
JP14420594A
Publication Date:
January 16, 1996
Filing Date:
June 27, 1994
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON TELEGRAPH & TELEPHONE
NIPPON HANDA KK
NIPPON BELL PARTS KK
International Classes:
B23K35/22; B23K35/363; C08L27/00; C08L27/18; H05K3/34; (IPC1-7): B23K35/363; B23K35/22; C08L27/18
Attorney, Agent or Firm:
Junnosuke Nakamura