Title:
ソルダペースト、それを用いた接合方法、および接合構造
Document Type and Number:
Japanese Patent JP5533876
Kind Code:
B2
Abstract:
A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.
Inventors:
Nakano Kosuke
Hidekiyo Takaoka
Hidekiyo Takaoka
Application Number:
JP2011529863A
Publication Date:
June 25, 2014
Filing Date:
August 12, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B23K35/22; B23K1/00; B23K35/14; B23K35/26; B23K35/30; B23K35/363; C22C9/05; C22C9/06; C22C12/00; C22C13/00; C22C13/02; H05K3/34; B23K101/40
Domestic Patent References:
| JP2002254195A | 2002-09-10 | |||
| JP2002254194A | 2002-09-10 | |||
| JP2003211289A | 2003-07-29 | |||
| JP2003094193A | 2003-04-02 | |||
| JP2002254195A | 2002-09-10 | |||
| JP2002254194A | 2002-09-10 | |||
| JP2003211289A | 2003-07-29 | |||
| JP2003094193A | 2003-04-02 |
Foreign References:
| WO2007125861A1 | 2007-11-08 | |||
| WO2006075459A1 | 2006-07-20 | |||
| WO2007125861A1 | 2007-11-08 | |||
| WO2006075459A1 | 2006-07-20 |
Attorney, Agent or Firm:
Hitoshi Nishizawa