To solve conventional solder paste problems such as deteriorated printability which is due to increased viscosity caused by reaction between solder powder and flux over a long period, frequency of oxidation-caused minute solder balls at the time of reflow soldering, and poor solderability incidental to the solder paste using solder powder covered with a coating material for the purpose of coping with the foregoing problems.

The solder paste is constituted by kneading flux with solder powder coated with urea on the surface. Then, as a method for coating the solder powder, a coating liquid is prepared by dissolving 1-20 mass% of urea in a solvent and filtered after the solder powder is put in, with the solvent subsequently evaporated to dry the solder powder.