PURPOSE: To print and apply a proper amount of solder paste on a substrate in order to simultaneously mount a flip chip part and a usual chip part different in solder use quantity on the substrate to subject the same to reflow fixing.

CONSTITUTION: Solder paste 5 is printed and applied on all of the connection lands 4 of a substrate 3 simultaneously loaded with usual chip parts 12 and flip chip parts 13 using the printing mask 1 for the flip chip parts 13 and, subsequently, solder paste 11 is printed and applied on the substrate using the printing mask 9 for the usual chip parts 12 so as to be superposed only on the connection lands 4 of the usual chip parts 12 to remove the printing masks 1, 9.