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Patent Searching and Data


Title:
SOLDER PHOTORESIST INK COMPOSITION
Document Type and Number:
Japanese Patent JPH10282665
Kind Code:
A
Abstract:

To provide the solder photoresist ink composition small in a hardenable exposure amount and high in storage stability, weak alkali developability, adhesion to a cured coated substrate, heat resistance, and surface hardness by using a specified UV-curing resin.

This solder photoresist ink composition contains an UV-curing resin, a photopolymerization initiator, a diluent, and a thermosetting resin, and the UV-curing resin is obtained by reaction of the sulfoxyl groups of a resin having radically polymerizable unsaturated acyl groups and carboxyl groups with a compound having one epoxy group and one or more radically polymerizable unsaturated groups in one molecule. A resin obtained by allowing a dibasic acid anhydride to react with the reaction product of an epoxy resin and unsaturated monocarboxylic acid is, preferably, used for the resin having the radically polymerizable unsaturated acyl groups and the carboxylic groups usable for the material of the ultraviolet setting resin, and this material is not specially limited.


Inventors:
TSUKATANI TOSHIHIDE
Application Number:
JP1997000100912
Publication Date:
October 23, 1998
Filing Date:
April 03, 1997
Export Citation:
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Assignee:
NIKKA CHEMICAL IND CO LTD
International Classes:
G03F7/027; C08F2/50; C09D11/00; G03F7/028; G03F7/032; G03F7/038; H05K3/28; (IPC1-7): G03F7/038; C09D11/00; G03F7/027; G03F7/028; G03F7/032; H05K3/28
Attorney, Agent or Firm:
内山 充