PURPOSE: To shorten the solder plating treatment time and to prevent a solder plating liquid from being deteriorated by a method wherein a means which causes the flow of the solder plating liquid toward individual leads is installed in a position which is away from a liquid face opened to the air at the solder plating liquid.
CONSTITUTION: Means 12b to 12d which cause the flow of a solder plating liquid A toward individual leads 6 are installed in positions which are away from a liquid face L opened to the air at the solder plating liquid A. By using the means 12b to 12d, the flow of the solder plating liquid A is caused toward a plurality of leads 6 which have been arranged and installed around a semiconductor device body 5. As a result, a solder plating operation in a required film thickness can be executed. Since the flow of the solder plating liquid A by using the means 12b to 12d is caused in the positions away from the liquid face L of the solder plating liquid, the excess air is not mixed with the solder plating liquid A. Thereby, it is possible to shorten the solder plating treatment time and to prevent the solder plating liquid from being deteriorated.
| JP5920276 | The Dros removal device in Snout |
| JPH02111860 | PRODUCTION OF HOT DIP PLATED METAL SHEET |
YAMAMURA TAKAYOSHI
NISHIMURA SEIYA
TAKABAYASHI MASAYOSHI
MAEJIMA YOSHIHISA
| JPS5719394A | 1982-02-01 | |||
| JPH02111898A | 1990-04-24 | |||
| JPH02205697A | 1990-08-15 |
Next Patent: LEAD FRAME, AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING IT