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Title:
SOLDER POWDER, ITS MANUFACTURE AND SOLDER PASTE
Document Type and Number:
Japanese Patent JP3943718
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain an oxydation preventing effect by forming an organometallic compound of benzotriazole (BTA) on the surface of solder which is mainly composed of Sn-Zn or Sn-Zn-Bi and does not incorporating Pb.
SOLUTION: Preferably, an organometallic compound is Zn, also the grain size of solder powder is 10-40 μm, and also the quantity of Zn compound of benzotriazole is 0.01-1.0%. Preferably, solder alloy powder is reacted with a vapor obtained by vaporizing benzotriazole, and an organometallic compound between metal of a solder alloy and benzotriazole is formed on the surface of the solder alloy. The reactional temperature is set at 50°C-120°C. Benzotriazole is a corrosion inhibitor for Cu, forms a stable compound with Cu and protects the surface of Cu. Benzotriazole easily forms a compound with Zn as well and is effective for the surface treatment of nonleaded solder incorporating Zn.


Inventors:
Kenzo Hanawa
Kiyotaka Yanagi
Application Number:
JP18207498A
Publication Date:
July 11, 2007
Filing Date:
June 29, 1998
Export Citation:
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Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B23K35/22; B23K35/40; B22F1/02; B23K35/26; B23K35/36; C22C13/00; C23F11/00; (IPC1-7): B23K35/26; B22F1/02; B23K35/22; B23K35/36; B23K35/40; C23F11/00; //C22C13/00
Domestic Patent References:
JP9001382A
JP9327789A
JP2000517092A
JP59150001A
Foreign References:
WO1998008362A1
Attorney, Agent or Firm:
Toshiro Mitsuishi
Tadahiro Mitsuishi