Title:
Solder printing machine
Document Type and Number:
Japanese Patent JP6341014
Kind Code:
B2
Inventors:
Mitsumasa Kagaya
Application Number:
JP2014185808A
Publication Date:
June 13, 2018
Filing Date:
September 12, 2014
Export Citation:
Assignee:
NEC
International Classes:
B41F35/00; B41F15/08; H05K3/34
Domestic Patent References:
| JP2007196562A | ||||
| JP2009196248A | ||||
| JP200118367A | ||||
| JP200138886A | ||||
| JP2011189669A | ||||
| JP201434207A | ||||
| JP2003266647A |
Foreign References:
| US6036787 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka