Title:
Solder printing machine
Document Type and Number:
Japanese Patent JP6357995
Kind Code:
B2
Inventors:
Mitsumasa Kagaya
Application Number:
JP2014185807A
Publication Date:
July 18, 2018
Filing Date:
September 12, 2014
Export Citation:
Assignee:
NEC
International Classes:
B41F15/08; B41F15/12; B41F35/00; H05K3/34
Domestic Patent References:
| JP2002254608A | ||||
| JP2007196562A | ||||
| JP2001018367A | ||||
| JP2001038886A | ||||
| JP2006001057A | ||||
| JP10100388A | ||||
| JP2011178078A | ||||
| JP2001138493A |
Foreign References:
| US6036787 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka