Title:
SOLDER TREATMENT EQUIPMENT
Document Type and Number:
Japanese Patent JP2018020369
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide solder treatment equipment capable of using the heat of an iron tip to surely melt a solder chip on heating and to surely supply moten solder to a soldering part.SOLUTION: Solder treatment equipment comprises a vertically extending nearly cylindrical iron tip capable of heating and a solder receiving part that brings solder chips supplied from a solder hole in the iron tip into contact with the inner wall of the iron tip, and makes the distance from a soldering part on a soldering board to be soldered to the solder receiving part double or less of the diameter of a solder hole, thereby surely supplying molten solder to the soldering part.SELECTED DRAWING: Figure 4
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Inventors:
EBISAWA MITSUO
Application Number:
JP2016154368A
Publication Date:
February 08, 2018
Filing Date:
August 05, 2016
Export Citation:
Assignee:
AND CO LTD
International Classes:
B23K3/03; B23K3/02; B23K3/06; H05K3/34