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Patent Searching and Data


Title:
SOLDER RECOVERING METHOD, AND SOLDER RECOVERING APPARATUS
Document Type and Number:
Japanese Patent JP2005105312
Kind Code:
A
Abstract:

To improve the recovery rate of solder from a dross lump produced at the time of soldering operation.

A dross lump 2 produced at the time of soldering operation is recovered, and is heated by a heating furnace 1. After the fusion of solder 3, further, heating is performed till dross 4 is made into a dry ash shape. The ash-shaped dross 4 is scooped up with a perforated hand ladle 5 together with the fused solder 3 from the heating furnace 1, and they are sifted out from the upper part of a cooling tank 6 stored with a cooling liquid 7. The solder 3 in a fused state is made into a drop shape or a linear shape, and falls down. On the other hand, the ash-shaped dross 4 falls down in a dry shape. They are solidified with the cooling liquid 7 in the cooling tank 6. Thus, the dross lump 2 is separated into the powdery dross 4 having a pore size smaller than that of the perforated hand ladle 5 and the solder 3 larger than the powdery dross 4. At the time when they are scooped up with the perforated hand ladle 5, and are sifted out, the solder 3 of high purity is left in the perforated hand ladle 5.


Inventors:
IWASAKI RYUJI
OKADA KIYOSHI
INOUE TOSHIAKI
ISHIKANE ATSUSHI
Application Number:
JP2003337457A
Publication Date:
April 21, 2005
Filing Date:
September 29, 2003
Export Citation:
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Assignee:
WAKO GIKEN KK
International Classes:
B23K3/06; C22B7/00; C22B7/04; C22B19/30; (IPC1-7): C22B7/00; C22B7/04; C22B19/30
Attorney, Agent or Firm:
Shogo Ehara
Hideka Tanaka
Yoshiyuki Shiraishi
Kunihiko Shiromura
Tsuyoshi Kumano
Hiroaki Yamane