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Patent Searching and Data


Title:
SOLDER RECOVERY DEVICE
Document Type and Number:
Japanese Patent JP2010168625
Kind Code:
A
Abstract:

To recover a higher purity reclaimed solder when oxidized scum is removed from solder dross, and also to dispose of only the oxidized scum without entraining the reclaimed solder.

An agitation unit 3 is set to an opening 2a of a solder melting device 2, and a stirring blade 32 is inserted into a solder storage tray 1. When agitating the solder dross 13 by the agitation blade 32, the solder dross 13 is gradually separated into the reclaimed solder 11 and the oxidized scum 12. After elapse of a prescribed agitation time, the agitation unit 3 is returned to the original position, and a suction unit 4 is set to the opening 2a. Thereafter, air or nitrogen gas is brown out from an air blowing blasting member 41, and the oxidized scum 12 in a separated state, is raised to the upper part of the solder storage tray 1 of the solder melting device 2, and the oxidized scum 12 is sucked with a sucking member 42 of the sucking unit 4.


Inventors:
INUMA TAKEHIRO
Application Number:
JP2009012748A
Publication Date:
August 05, 2010
Filing Date:
January 23, 2009
Export Citation:
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Assignee:
RICOH CO LTD
International Classes:
C22B7/00; B23K3/06; C22B7/04; C22B9/02; C22B19/30; F27D3/15
Domestic Patent References:
JPS63140059U1988-09-14
Attorney, Agent or Firm:
Mitsutake Murayama