PURPOSE: To prevent solder from being extruded to the outside of an electrode to be joined by a bonding tool, by using plural tool heads, in the titled device joining a wiring pattern formed on a wiring board, and a lead wire.

CONSTITUTION: For instance, two tool heads 6, 7 are provided on a bonding tool 5. At the time of joining an electrode 2 formed on the upper face of a substrate 1, and a lead wire 3 by this reflow joining device, they are aligned, and thereafter, the heads 6, 7 of the heated tool 5 are pressed on the lead wire 3. As a result, the wire 3 is heated by the heads 6, 7 and tends to stretch, but since both ends of a joint part of the wire 3 are pressed down by the heads 6, 7, the joint part of the wire 3 is raised between the heads 6, 7 and in its state, attack solder 4 is melted. Therefore, solder of a part which is pressed down by the heads 6, 7 gets wet and expands in a gap between the electrode 2 and the wire 3, and is used as connecting solder 8. IN such a state, the solder 8is cooled until it is solidified, and thereafter, by allwoing the tool 5 to ascend, the electrode 2 and the wire 3 are joined.