Title:
SOLDER REFLOW METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2009224657
Kind Code:
A
Abstract:
To provide a solder reflow method for a semiconductor device, with which a thick solder layer is formed and joining life is prolonged.
In the solder reflow method for the semiconductor device 1 with which a solder material 3' is supplied onto an insulating substrate 2 and surface-mounted components including at least a semiconductor element 4 are positioned thereupon and heated, the solder material 3' is fused in a state wherein a guide member 5 which comes into contact with the entire circumference of the semiconductor element 4 and encloses the outer periphery of the solder material 3' is set on the insulating substrate 2.
Inventors:
OGASAWARA SHOICHI
Application Number:
JP2008069105A
Publication Date:
October 01, 2009
Filing Date:
March 18, 2008
Export Citation:
Assignee:
CALSONIC KANSEI CORP
International Classes:
H01L21/52
Attorney, Agent or Firm:
Masamichi Ayata