Title:
SOLDER REFLOW OVEN
Document Type and Number:
Japanese Patent JP2004306140
Kind Code:
A
Abstract:
To provide a solder reflow oven capable of extending the distance that a workpiece is heated to solder reflow temperatures without interference of the workpiece with the oven in an upstream side and a downstream side.
The solder reflow oven comprises a reflow zone for heating a workpiece 32 to the temperature effective to reflow solder by using heated air. The reflow zone comprises a nozzle 80 having divergent vanes 84 that direct shear layers 90 into an adjacent zones to extend the distance over which the workpiece is heated to effective solder reflow temperature.
Inventors:
GOENKA LAKHI NANDLAL
Application Number:
JP2004115169A
Publication Date:
November 04, 2004
Filing Date:
April 09, 2004
Export Citation:
Assignee:
VISTEON GLOBAL TECH INC
International Classes:
B23K1/008; A21B1/00; B23K1/00; B23K3/04; F27B9/00; F27B9/10; F27B9/24; F27B9/36; F27B17/00; F27D5/00; F27D9/00; F27D11/00; H05K3/34; B23K101/42; (IPC1-7): B23K1/008; B23K3/04; H05K3/34
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Shishido Kaichi
Village shrine Atsuo
Disciple Maru Ken
Ino Sato
Fumiaki Otsuka
Shishido Kaichi
Village shrine Atsuo
Disciple Maru Ken
Ino Sato