Title:
SOLDER, SOLDERING METHOD AND SOLDERED JOINT SUBSTRATE
Document Type and Number:
Japanese Patent JP2003126988
Kind Code:
A
Abstract:
To provide a solder meeting, for example, a requirement for soldering, without use of such a lead as adversely affecting environment and the like.
The soldering method and the soldered joint substrate use the solder containing Sn in major proportions, Zinc of 3-12% by weight, and oxygen content of 100 ppm or less.
Inventors:
HIGASHINAKAGAHA EMIKO
TEJIMA KOICHI
ARAI SHINJI
TEJIMA KOICHI
ARAI SHINJI
Application Number:
JP2002213093A
Publication Date:
May 08, 2003
Filing Date:
March 08, 1995
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B23K35/26; C22C13/00; H05K3/34; (IPC1-7): B23K35/26; C22C13/00; H05K3/34
Attorney, Agent or Firm:
Hidekazu Miyoshi (7 outside)
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