PURPOSE: To provide a solder supply method wherein a short circuit is not developed even if an interval between terminals of a circuit element is fine, positioning operation of a terminal is easy and infavorable misregistration is not caused.

CONSTITUTION: The title method is comprised of a process for forming a photosensitive layer 22 of a fixed thickness consisting of photo-setting resist in one side or both sides of a printed wiring board 21, a process for performing exposure for the photosensitive layer 22 through a mask film, a process for removing a part of the photosensitive layer 22 covering a land pattern 26 and forming a number of holes 24 which are opened in one side of both sides of the photosensitive layer 22 for each land pattern 26 and a process for charging a number of holes 24 with solder 25.