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Patent Searching and Data


Title:
SOLDERING APPARATUS AND SOLDERING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2009012053
Kind Code:
A
Abstract:

To provide a soldering apparatus and a soldering method using the same for enhancing electric characteristics of a soldered part and reliability of the electric connection, and achieving the beautiful finished shape of the soldered part.

The soldering apparatus comprises an evacuation chamber 40, an evacuation device 20, a heating means 30, a tool 70 having workpiece setting units 72A, 74A for setting a workpiece 50, a soldering unit 76 for soldering the workpiece 50 set to the workpiece setting units 72A, 74A, and a solder storage unit 78 for storing solder 60 to be supplied to the soldering unit 76, and a control means 80. The workpiece 50 is set to the workpiece setting units 72A, 74A, the tool 70 for supplying the solder 60 to the solder storage unit 78 is arranged in the evacuation chamber 40, the evacuation device 20 and the heating means 30 are controlled by the control means 80, the tool 70 is heated to melt the solder 60 after the inside of the evacuation chamber 40 is evacuated, and the solder is filled in the soldering unit 76 to join the workpiece with the solder.


Inventors:
TAKIZAWA TOYOMI
TOKIMITSU FUJIO
Application Number:
JP2007177728A
Publication Date:
January 22, 2009
Filing Date:
July 05, 2007
Export Citation:
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Assignee:
AIOI DENSHI KK
International Classes:
B23K31/02; B23K3/00; B23K3/06
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu