To provide a soldering device for collimator, which can enhance the reliability of a product and shorten the manufacturing time.
This soldering device comprises a housing receiving unit for receiving a housing, a housing feed unit having a housing chucking unit for chucking the housing 20 received by the housing receiving unit and a housing moving unit for moving the housing chucking unit to a predetermined soldering position, a plurality of collimator holding units which have a holding unit to respectively hold a plurality of collimators 10 and 10', are disposed in an approaching/retracting manner to/from the soldering position, and respectively insert the plurality of collimators in the housings moved to the soldering position, and a soldering unit which is disposed adjacent to the soldering position, and solders the plurality of collimators inserted in the housings via through-holes in the housings 20a and 20b within the housings.
PARK DAIKAN
SEN HONSHAKU
KIN HEIKON
