Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
Japanese Patent JP2023093041
Kind Code:
A
Abstract:
To provide a soldering device and a soldering method that can facilitate the processing of a nozzle through which it is possible to improve productivity.SOLUTION: A soldering device 1 includes a head part 3, which is an upper unit for supplying solder, a thread solder cutting mechanism part 40 (described below), which is a cut unit for cutting a thread solder 2, which is solder, to make a solder piece 2b below the head unit, a nozzle 60 located on the lower portion of the thread solder cutting mechanism part 40, and a heater 51 that heats the nozzle 60. The nozzle 60 has a first nozzle part 63 that constitutes a lower portion of the nozzle 60 and a second nozzle part 64 that constitutes an upper portion of the nozzle 60. The second nozzle part 64 is formed of a metal material that has higher heat conductivity than the first nozzle part 63.SELECTED DRAWING: Figure 9
Inventors:
ATARU SHINICHIRO
Application Number:
JP2021208435A
Publication Date:
July 04, 2023
Filing Date:
December 22, 2021
Export Citation:
Assignee:
PARAT CO LTD
International Classes:
H05K3/34; B23K3/02; B23K3/06
Attorney, Agent or Firm:
Hironori Nishihara
Ryohito Noro
Ryohito Noro
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