Title:
SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP2009099670
Kind Code:
A
Abstract:
To provide a soldering device that is free from causing any failure in quality without unwanted soldering flux and chip.
The soldering device includes a flux supplying pipe 18, a string solder supplying pipe 17, a hollow cylindrical heater pipe 11 including built-in flux supplying pipe and solder supplying pipe 17 with a heater 13 surrounding a lead pin 2 fixed at the front end, and a cover pipe 12 holding movably the heater pipe 11 in the direction of an output hole.
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Inventors:
KAJIURA YOSHIHIRO
Application Number:
JP2007267945A
Publication Date:
May 07, 2009
Filing Date:
October 15, 2007
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
H05K3/34; B23K1/00; B23K3/00; B23K3/06; B23K101/42
Attorney, Agent or Firm:
Patent Business Corporation Cosmos Patent Office