Title:
SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP2009245964
Kind Code:
A
Abstract:
To provide a soldering device capable of reducing a running cost.
Around a solder tub 12, a catalyst part 15 is provided. In the catalyst part 15, by the passing through a catalyst of the gas mixture of a combustible gas 22 and the atmosphere 23 supplied from a gas supply part 21 provided on the outer side of the solder tub 12, catalyzed combustion is carried out. By reaction heat generated during the catalyzed combustion, solder stored in the solder tub 12 is auxiliary heated.
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Inventors:
MATSUOKA TARO
FUKANO TAKASHI
FUKANO TAKASHI
Application Number:
JP2008087366A
Publication Date:
October 22, 2009
Filing Date:
March 28, 2008
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
TAMURA FA SYSTEM CO LTD
TAMURA FA SYSTEM CO LTD
International Classes:
H05K3/34
Attorney, Agent or Firm:
Masatomo Sugiura
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