Title:
SOLDERING FLUX AND SEMI-CONDUCTOR DEVICE HAVING MOUNTING STRUCTURE USING SOLDERING FLUX
Document Type and Number:
Japanese Patent JP2007209999
Kind Code:
A
Abstract:
To provide a soldering flux for obtaining excellent connection strength in soldering, and a semi-conductor device having mounting structure using the soldering flux.
The soldering flux 13 is used for soldering a solder alloy 12 on a copper electrode or an electrode 11 with an electroless nickel plating applied to a surface of the copper electrode, and the flux 13 contains metallic salt of zinc.
COPYRIGHT: (C)2007,JPO&INPIT
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Inventors:
SAKUYAMA SEIKI
Application Number:
JP2006031316A
Publication Date:
August 23, 2007
Filing Date:
February 08, 2006
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B23K35/363; B23K1/20; B23K35/26; C22C13/00; H01L21/60; H05K3/34
Domestic Patent References:
| JP2000317682A | 2000-11-21 | |||
| JP2001001180A | 2001-01-09 | |||
| JP2000252380A | 2000-09-14 | |||
| JP2004306092A | 2004-11-04 | |||
| JPS6072696A | 1985-04-24 | |||
| JPS6160266A | 1986-03-27 |
Attorney, Agent or Firm:
Tadahiko Ito