Title:
はんだ付け治具およびはんだ付け装置
Document Type and Number:
Japanese Patent JP7239269
Kind Code:
B2
Abstract:
To provide a soldering jig and a soldering device capable of performing immersion of a plurality of semiconductor devices in a solder bath in a short time.SOLUTION: A soldering jig according to the present invention includes a mounting plate, a holding plate provided above the mounting plate, a spring whose lower end is fixed to the holding plate, and a frame having a holding portion that holds the mounting plate, and an outer frame portion that extends from the holding portion to the upper side of the holding plate and to which the upper end of the spring is fixed, and the mounting plate is provided with a plurality of through holes penetrating from the upper surface to the back surface, and the upper surface of the mounting plate is provided with a plurality of semiconductor devices each having a plurality of lead terminals, and the plurality of lead terminals are respectively inserted into the plurality of through holes and protrudes from the rear surface of the mounting plate, and the holding plate presses the plurality of semiconductor devices toward the mounting plate by the elastic force of the spring.SELECTED DRAWING: Figure 1
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Inventors:
Yusuke Inoue
Application Number:
JP2018006561A
Publication Date:
March 14, 2023
Filing Date:
January 18, 2018
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H05K3/34; H01L23/50
Domestic Patent References:
| JP63254792A | ||||
| JP5945077A |
Attorney, Agent or Firm:
Patent Attorney Takada / Takahashi International Patent Office