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Patent Searching and Data


Title:
SOLDERING METHOD BY LASER
Document Type and Number:
Japanese Patent JPS62137174
Kind Code:
A
Abstract:

PURPOSE: To execute a work with a high efficiency and to obtain a product having a high accuracy by filling a fluid having a light shielding property, between a glass plate which has been placed so as to cover a lead part of flat lead parts on a substrate, and the substrate, and irradiating a laser light through the glass plate.

CONSTITUTION: On a printed circuit board 1, flat lead parts 3 are placed, and a glass plate 10 is placed so as to cover a lead part 4 of flat lead parts 3. Subsequently, a fluid having a light shielding property is filled between the glass plate 10 and the printed circuit board 1. Next, a laser light 6 is irradiated and scanned to the lead part 4 through the glass plate 10. As a result, the lead part 4 is heated selectively, and soldering 12 can be executed between the lead part 4 and the printed circuit board 1. According to this method, the work efficiency is improved and soldering can be executed with a high accuracy.


Inventors:
SAKAMURA TOSHIHIRO
Application Number:
JP27743185A
Publication Date:
June 20, 1987
Filing Date:
December 10, 1985
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B23K26/18; B23K1/005; H05K3/34; (IPC1-7): B23K3/04; B23K26/18
Attorney, Agent or Firm:
Sadaichi Igita