To make soldering junction temperature uniform to an electronic circuit board where various kinds of electronic components having different heat capacity, heat-resistance properties, or the like are mixedly mounted, and to obtain excellent quality in soldering.
A soldering device conveys an electronic circuit board 6 where an electronic component 9 is mounted by a conveyance means, and fuses solder by the heating of a heating oven for joining the electronic component 9. Also, the soldering device is equipped with a means for heating or cooling the electronic component 9 that is mounted onto an electronic circuit board 6, and a means for moving a means 7 for heating and cooling at nearly the same speed as the conveyance speed of the electronic circuit board 6.
DAIROKU NORIYUKI
MIURA KAZUMA
SHIMOKAWA HIDEYOSHI
NAKATSUKA TETSUYA
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