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Patent Searching and Data


Title:
SOLDERING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2001358454
Kind Code:
A
Abstract:

To make soldering junction temperature uniform to an electronic circuit board where various kinds of electronic components having different heat capacity, heat-resistance properties, or the like are mixedly mounted, and to obtain excellent quality in soldering.

A soldering device conveys an electronic circuit board 6 where an electronic component 9 is mounted by a conveyance means, and fuses solder by the heating of a heating oven for joining the electronic component 9. Also, the soldering device is equipped with a means for heating or cooling the electronic component 9 that is mounted onto an electronic circuit board 6, and a means for moving a means 7 for heating and cooling at nearly the same speed as the conveyance speed of the electronic circuit board 6.


Inventors:
SATO ISAO
DAIROKU NORIYUKI
MIURA KAZUMA
SHIMOKAWA HIDEYOSHI
NAKATSUKA TETSUYA
Application Number:
JP2000000180716
Publication Date:
December 26, 2001
Filing Date:
June 12, 2000
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B23K1/00; B23K1/008; B23K3/04; B23K31/02; H05K3/34; B23K101/42; (IPC1-7): H05K3/34; B23K1/00; B23K1/008; B23K3/04; B23K31/02
Attorney, Agent or Firm:
作田 康夫