To provide a soldering method for a metallic member capable of obtaining a bonded condition in which sufficient fillet is formed when a cylindrical metallic member is inserted in a hole of other metallic member and bonded by soldering.

Bead working is performed at an end part 11 of a metallic member 1 to form a continuous projected part 111 on its outer surface in the circumferential direction, a part 112 between the projecting part 111 and an edge 11a of the end part 11 is dipped vertically in the molten solder, the ultrasonic wave is applied thereto to form the tinning 33 on the outer surface of the part 112, the part 112 is inserted in a hole of other metallic member, and the tinning 33 is melted to bond the end part 11 with other metallic member.