Title:
SOLDERING METHOD AND MOLDING SOLDER USED THEREIN
Document Type and Number:
Japanese Patent JPH0738246
Kind Code:
A
Abstract:
PURPOSE: To provide a soldering method which can supply a suitable solder amounts necessary for chiplike electronic components having different sizes without much time and effort and without cost increase.
CONSTITUTION: A method for soldering comprises the steps of printing cream solder 13, mounting a resistor 14 at a position printed with the solder 13a, mounting a chiplike forming solder 15, and reflow-heating it.
Inventors:
OZAKI TOMOKI
Application Number:
JP18151493A
Publication Date:
February 07, 1995
Filing Date:
July 22, 1993
Export Citation:
Assignee:
FUJITSU TEN LTD
International Classes:
H05K3/34; (IPC1-7): H05K3/34; H05K3/34
Attorney, Agent or Firm:
Ryuji Inouchi
Next Patent: SOLDER PRINTING METHOD AND PRINTER