Title:
SOLDERING METHOD OF MULTIPLE-LEAD ELEMENT
Document Type and Number:
Japanese Patent JPH05283587
Kind Code:
A
Abstract:
PURPOSE: To solder a multiple-lead element at fine pitch on a wiring pattern by a hot press method.
CONSTITUTION: A thin sheet solder is placed on wiring patterns 3 and an SMI provided with multiple-lead terminals 2, 2,..., 2 is then placed thereon. Next, the soldering between wiring patterns 3, 3,..., 3 and lead terminals 2, 2,..., 2 is carried out by heating the lead terminals 2, 2,..., 2 with an iron 12 pressed thereon.
Inventors:
Toyama Toshio
Application Number:
JP10254592A
Publication Date:
October 29, 1993
Filing Date:
March 30, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/50; B23K1/00; H05K3/34; (IPC1-7): H01L23/50; H05K3/34
Attorney, Agent or Firm:
Akio Waki
Previous Patent: IMIDAZO*2*11B*THIAZOLES AND MEDICINE FOR CONTROLLING GLYCOSURIA
Next Patent: THIAZOLOPYRIDINE-CARBOXYLIC ACID DERIVATIVES
Next Patent: THIAZOLOPYRIDINE-CARBOXYLIC ACID DERIVATIVES