Title:
SOLDERING METHOD OF PRINTED BOARD
Document Type and Number:
Japanese Patent JPH06177529
Kind Code:
A
Abstract:
PURPOSE: To provide a method of soldering with cream solder, wherein wherein an electronic part is prevented from being ill connected due to solder which creeps up the lead terminal of the part and protected against internal damage caused by heat.
CONSTITUTION: An electronic part 3 is mounted on a cream solder 4 provided onto a pad 2 of a printed board 1, inactive liquid 9 whose boiling point is higher than a melting point of the cream solder 4 is heated, the rear side of the printed board 1 is brought into direct contact with the inactive liquid 9 for a few seconds, the cream solder 4 is melted by heat conducted through the printed board 1 to solder the lead terminal 5 of the electronic part 3 to the pad 2 of the printed board 1.
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Inventors:
SHIRATA NAOTERU
SAKUMA TAKEO
EBISAWA HIROSHI
IMAIZUMI HARUYUKI
SAKUMA TAKEO
EBISAWA HIROSHI
IMAIZUMI HARUYUKI
Application Number:
JP35115392A
Publication Date:
June 24, 1994
Filing Date:
December 07, 1992
Export Citation:
Assignee:
HITACHI TELECOMM TECH
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Teruo Aoki