SOLDERING METHOD

Japanese Patent JP2005167257

A

To provide a soldering method of using a soldering composition having specific composition for easy alloying in a short time period at the time of reflow soldering so as to form an alloy having a melting point higher than that of the composition, thereby allowing soldering under almost the same temperature condition even when performing further soldering on a soldered substrate or the like.

A soldering method uses a soldering composition which is free of lead and contains a first metal component and a second metal component. The melting point of the first metal component is within a range of 183 to 260°C. The kind of the second metal component and the relative quantity of the first metal component and the second metal component are such that the second metal component is diffused into the first metal component which is in a molten state so that an alloy of which melting point is within a range of 260 to 1,500°C can be formed. In the soldering method, the first metal component is molten, and the second metal component is diffused into the molten first metal component to form the alloy, which is used for soldering.

IGARASHI KATSUHIKO
TANAKA HIROBUMI
SOTOMI TORU
NINOMIYA RYUJI
MATSUNAGA JUNICHI

JP2004351199A

June 23, 2005

December 03, 2004

Click for automatic bibliography generation  

TDK CORP
MITSUI MINING & SMELTING CO

B23K35/26; B23K35/28; B23K35/30; C22C5/06; C22C9/02; C22C13/00; C22C13/02; H05K3/34; (IPC1-7): H05K3/34

Hiroyuki Kurihara

Previous Patent: ORGANIC FIELD-EFFECT TRANSISTOR WITH ACTIVE CHANNEL FORMED OF DENSIFIED LAYER

Next Patent: TWO-DIMENSIONAL IMAGE DETECTING DEVICE