Title:
SOLDERING METHOD
Document Type and Number:
Japanese Patent JPH04237557
Kind Code:
A
Abstract:
PURPOSE: To execute soldering in stable quality by automatizing even in the case of using cream solder.
CONSTITUTION: At the time of executing the soldering under condition of non- contacting of optical beam 7, etc., after executing preheating at low energy density, the soldering heating is executed at high energy density. By using the non-contacting heat source, the soldering heating is executed under stable condition for a long term. Before soldering heating, by preheating at the low energy density, fears of spattering of the cream solder 6 due to rapid heating and burning of a print substrate 1, are eliminated.
Inventors:
TAKASAKI SHIGEO
SAYAMA MAKOTO
TANAKA SHIGE
KOBAYASHI MAKOTO
TAKAGI SEIJI
MIZUUCHI SHOICHI
SAYAMA MAKOTO
TANAKA SHIGE
KOBAYASHI MAKOTO
TAKAGI SEIJI
MIZUUCHI SHOICHI
Application Number:
JP372691A
Publication Date:
August 26, 1992
Filing Date:
January 17, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K1/005; B23K26/00; H05K3/34; (IPC1-7): B23K1/005; B23K26/00; H05K3/34
Domestic Patent References:
| JPS60180666A | 1985-09-14 |
Attorney, Agent or Firm:
Tomoyuki Takimoto