SOLDERING OF PRINTED-CIRCUIT BOARD

Japanese Patent JPH01132198

A

PURPOSE:To eliminate a defective soldering operation of a chip component and to realize a correction-free operation by a method wherein a solder wave by a second nozzle equipped with a dam stopper extended in an advance direction of a printed circuit board is made higher than a solder wave by a first nozzle and the printed circuit board is passed through the solder wave while the board is tilted upward with reference to the advance direction of the printedcircuit board, or the like. CONSTITUTION:When a soldering operation is to be executed while a molten solder 17 is supplied from two nozzles 15, 16 and is made to flow to the under surface of a printed circuit board 4 positioned in such a way that a chip component 3 mounted by an adhesive is faced downward and the printed circuit board 4 is passed through the first nozzle 15 and the second nozzle 16 in this order, nearly symmetrical solder waves 19, 20 are formed with reference to an exhaust nozzle 18 of the molten solder at the first nozzle 15; a dam stopper 26 extended in an advance direction of the printed circuit board 4 is installed at the second nozzle 16; a stationary face showing that the molten solder stays in front of the advance direction of the printed circuit board 4 is formed. The stationary face is formed to be higher than the first nozzle 15; the printed circuit board 4 is tilted upward with reference to its advance direction and is passed through solder waves 19, 20, 27 caused by the first nozzle and the second nozzle 15, 16.

MURAKAMI SHUICHI
MATSUDA CHUICHI
SAEKI KEIJI

JP25408788A

May 24, 1989

October 07, 1988

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MATSUSHITA ELECTRIC IND CO LTD

B23K1/08; H05K3/34; (IPC1-7): B23K1/08; H05K3/34

JPS57139993A

1982-08-30

Akira Kobiji (2 outside)

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