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Patent Searching and Data


Title:
SOLDERING STRUCTURE OF COMPONENT WITH LED TERMINAL
Document Type and Number:
Japanese Patent JPH0766541
Kind Code:
A
Abstract:

PURPOSE: To contrive to improve the soldering strength and reliability of the whole soldered parts by a method wherein adhesion parts for reinforcement are provided in such a way that they are made to continue to the soldered parts of the two lead terminals arranged at both ends of a plurality of lead terminals and the amount of solder of the two lead terminals arranged at both ends is increased more than that of solder of the other lead terminals.

CONSTITUTION: Circular adhesion parts 6a and 6f for reinforcement are respectively formed continuously to elliptical soldered parts 3a and 3f, in which the two lead terminals 5a and 5f arranged at both ends of a plurality of lead terminals are respectively inserted, on the outsides of the soldered parts 3a and 3f. Thereby, in the lead terminals 5a and 5f arranged at both ends, continuous large solder adhesion parts, which reach from the soldered parts 3a and 3f to the adhesion parts 6a and 6f, are formed and solder fillets of the solder adhesion parts are also formed remarkedly high. Accordingly, the amount of solder, which is adhered to these terminals 5a and 5f, is more than that of solder, which is adhered to the other lead terminals 5b to 5e, and the solder adhesion areas of the terminals 5a and 5f are also larger than those of the terminals 5b to 5e. As a result, the soldering strength of the whole soldered parts 3a and 3f can be increased.


Inventors:
Harayama, Masae
Application Number:
JP1993000214233
Publication Date:
March 10, 1995
Filing Date:
August 30, 1993
Export Citation:
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Assignee:
SONY CORP
International Classes:
H05K3/34; H05K1/11; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
松隈 秀盛