Title:
STRUCTURE FOR SOLDERING TERMINAL TO CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2017010705
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a structure for soldering a terminal to a circuit board capable of improving reliability of contact between the terminal and a soldering part of a land.SOLUTION: In the structure, a board contact part 23 in a distal end of a terminal 20 of a connector 10 for board and a land 3 of a circuit board 1 are soldered in the state where the board contact part 23 is mounted on the land 3. In a distal end of the board contact part 23, a projection 24 is provided which is folded closer to the circuit board 1 and on a surface of the land 3 of the circuit board 1, a recess 3b is provided. In the state where the projection 24 is caused to oppose the recess 3b, the board contact part 23 and the land 3 are soldered.SELECTED DRAWING: Figure 1
Inventors:
ITO YOSHITAKA
Application Number:
JP2015123488A
Publication Date:
January 12, 2017
Filing Date:
June 19, 2015
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H01R12/57; H01R4/02; H01R12/71
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
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