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Title:
固体培養基質盛込み装置及び固体培養基質盛込み方法
Document Type and Number:
Japanese Patent JP7387121
Kind Code:
B2
Abstract:
To provide a device for piling up a solid culture substrate and a method for piling up a solid culture substrate, which allow adjustment of the height of a solid culture substrate on a circular culture bed to make it possible to realize precision enhancement and precision stabilization in homogenization of the sedimentary layer thickness of the solid culture substrate and to intentionally make a difference in the sedimentary layer thickness.SOLUTION: The device comprises: a screw 21 disposed between a circumference of a circular culture bed 6 and a central axis of the circular culture bed 6 and configured to transport, in the radial direction of the circular culture bed 6, a solid culture substrate 7 supplied to the circular culture bed 6; a layer thickness measurement sensor 50 to measure the sedimentary layer thickness of the solid culture substrate 7 on the circular culture bed 6; a height adjustment mechanism for adjusting the height of the screw 21; and control means to control the height adjustment mechanism. The control means uses a measurement of the layer thickness measurement sensor to control the height adjustment mechanism, thereby adjusting the height of the screw 21 to adjust the height of the solid culture substrate 7 in the radial direction of the circular culture bed 6 to any value.SELECTED DRAWING: Figure 3

Inventors:
Asumi Mino
Toshihiro Okamoto
Naozumi Nishimura
Application Number:
JP2020007047A
Publication Date:
November 28, 2023
Filing Date:
January 20, 2020
Export Citation:
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Assignee:
Fujiwara Techno Art Co., Ltd.
International Classes:
C12M1/16
Domestic Patent References:
JP10191962A
JP11042079A
JP2012217414A
JP5161489A
Foreign References:
DE102004020885A1
Attorney, Agent or Firm:
Mori Patent Office